A multilayer wiring substrate includes a multilayer body in which a plurality of insulating layers is stacked and to which an electronic component is mounted, a plurality of connection terminals disposed on one principal surface of the multilayer body for connection to the electronic component, and a plurality of rear electrodes disposed on the other principal surface of the multilayer body, wherein the connection terminals are each arranged in overlapped relation to one of the rear electrodes when looked at in a plan view of the multilayer wiring substrate.