To provide a thermoplastic liquid crystal polymer film capable of suppressing change in relative dielectric constant before and after heating, and a laminated and a circuit board using the same. In this film, a change ratio of a dielectric constant (∈r2) of the film after heating to a dielectric constant (∈r1) of the film before the heating satisfies the following formula (I) where the film is heated for 1 hour at a temperature in a range from a temperature being 30° C. lower than a melting point of the film to a temperature being 10° C. higher than the melting point, |∈r2−∈r1|/∈r1×100≦5  (I) where ∈r1 denotes the relative dielectric constant before the heating, ∈r2 denotes the relative dielectric constant after the heating. These relative dielectric constants are measured at the same frequency in a range of 1 to 100 GHz.