Invention Grant
- Patent Title: Liquid composition and metal-based circuit board
- Patent Title (中): 液体成分和金属基电路板
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Application No.: US13636399Application Date: 2011-03-18
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Publication No.: US09538648B2Publication Date: 2017-01-03
- Inventor: Ryo Miyakoshi , Takeshi Kondo , Nobuaki Koyama , Kazuhiko Konomi
- Applicant: Ryo Miyakoshi , Takeshi Kondo , Nobuaki Koyama , Kazuhiko Konomi
- Applicant Address: JP Tokyo JP Kanagawa
- Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED,NHK SPRING CO., LTD
- Current Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED,NHK SPRING CO., LTD
- Current Assignee Address: JP Tokyo JP Kanagawa
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-068780 20100324
- International Application: PCT/JP2011/056645 WO 20110318
- International Announcement: WO2011/118539 WO 20110929
- Main IPC: H05K1/05
- IPC: H05K1/05
Abstract:
A liquid composition containing a liquid crystalline polyester, a solvent, and a boron nitride having a volume average particle diameter of not less than 10 μm and not more than 80 μm, wherein the amount of the boron nitride is 30 to 90% by volume based on the total amount of the liquid crystalline polyester and the boron nitride.
Public/Granted literature
- US20130037313A1 LIQUID COMPOSITION AND METAL-BASED CIRCUIT BOARD Public/Granted day:2013-02-14
Information query
