Invention Grant
- Patent Title: Carrier tape, package tape and series of electronic components
- Patent Title (中): 载带,包装胶带和一系列电子元件
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Application No.: US14103739Application Date: 2013-12-11
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Publication No.: US09538695B2Publication Date: 2017-01-03
- Inventor: Haruhiko Mori
- Applicant: MURATA MANUFACTURING CO., LTD.
- Applicant Address: JP Kyoto-Fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto-Fu
- Agency: Studebaker & Brackett PC
- Priority: JP2012-272918 20121214
- Main IPC: B65D73/02
- IPC: B65D73/02 ; H05K13/00

Abstract:
A series of electronic components formed using a carrier tape. The carrier tape is adapted to enable smoothly picking up even small-sized electronic components with a suction nozzle. The carrier tape has housing holes housing electronic components therein. The housing holes are arranged in the longitudinal direction. A top tape and a bottom tape are attached to the upper and lower surfaces of the carrier tape. Interval portions between the housing holes are provided with concave slots in their lower surfaces, thereby forming air flow paths. The air flow paths form air passages which enable smoothly picking up the small-sized electronic components using a suction nozzle.
Public/Granted literature
- US20140166534A1 CARRIER TAPE, PACKAGE TAPE AND SERIES OF ELECTRONIC COMPONENTS Public/Granted day:2014-06-19
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