Invention Grant
- Patent Title: Probe for ultrasonic diagnostic apparatus and method of manufacturing the same
- Patent Title (中): 超声波诊断仪的探头及其制造方法
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Application No.: US14749409Application Date: 2015-06-24
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Publication No.: US09538986B2Publication Date: 2017-01-10
- Inventor: Jin Woo Jung , Jeong Cheol Seo , Jae Yk Kim
- Applicant: SAMSUNG MEDISON CO., LTD.
- Applicant Address: KR Hongcheon-gun, Gangwon-do
- Assignee: SAMSUNG MEDISON CO., LTD.
- Current Assignee: SAMSUNG MEDISON CO., LTD.
- Current Assignee Address: KR Hongcheon-gun, Gangwon-do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2009-0023014 20090318
- Main IPC: A61B8/14
- IPC: A61B8/14 ; A61B8/00 ; B06B1/06 ; G10K11/00

Abstract:
A probe for an ultrasonic diagnostic apparatus includes including backing members, a first connector bonded between the backing members and including electrodes spaced from each other in an arrangement direction, a ground connector bonded between the backing members to be spaced from the first connector, and a piezoelectric member electrically connected to the electrodes and the ground connector. A method of manufacturing the same is also disclosed. The piezoelectric member is joined to the first connector and the ground connector or to first and second connectors and the ground connector via first and second electrode layers instead of using a complicated and laborious soldering operation, thereby enabling easy connection between the piezoelectric member and the connectors while preventing deterioration in performance caused by defective connection therebetween and deterioration in performance of the piezoelectric member caused by heat during manufacture.
Public/Granted literature
- US20150313574A1 PROBE FOR ULTRASONIC DIAGNOSTIC APPARATUS AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2015-11-05
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