Invention Grant
- Patent Title: Substrate bonding apparatus, substrate holding apparatus, substrate bonding method, substrate holding method, multilayered semiconductor device, and multilayered substrate
- Patent Title (中): 基板接合装置，基板保持装置，基板接合方法，基板保持方法，多层半导体器件和多层基板
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Application No.: US14062988Application Date: 2013-10-25
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Publication No.: US09539800B2Publication Date: 2017-01-10
- Inventor: Yoshiaki Kito , Hiroshi Shirasu , Masahiro Yoshihashi , Daisuke Yuki , Kazuhiro Suzuki , Isao Sugaya
- Applicant: NIKON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: NIKON CORPORATION
- Current Assignee: NIKON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
- Priority: JP2011-097873 20110426
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/68 ; B32B38/18 ; H01L21/683 ; H01L21/687 ; H01L23/12 ; B32B37/00 ; H01L21/20 ; B32B37/08 ; B32B38/00
Abstract:
Substrates are aligned and then bonded to each other. A substrate bonding apparatus includes a deformer that deforms at least a first one of two substrates that are to be bonded to each other in order to correct misalignment between the two substrates, a holder that holds the deformed first substrate in the deformed state achieved by the deformer, a transporter that transports the holder from a position at which the deformed first substrate is held by the holder while the first substrate remains deformed, and a bonder that bonds the first substrate that has been transported by the transporter to the second substrate. In the above-described substrate bonding apparatus, while the first substrate is not held by the holder, the deformer may deform the holder from a first state to a second state that is more deformed than the first state, and while the first substrate is held by the holder, the deformer may reduce the amount of the deformation of the holder to less than the amount of the deformation of the second state to deform the first substrate.
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