Invention Grant
US09540403B2 Bonding method, bondability improving agent, surface modification method, surface modifying agent, and novel compound
有权
粘合方法,粘合性改善剂,表面改性法,表面改性剂,新型化合物
- Patent Title: Bonding method, bondability improving agent, surface modification method, surface modifying agent, and novel compound
- Patent Title (中): 粘合方法,粘合性改善剂,表面改性法,表面改性剂,新型化合物
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Application No.: US14954147Application Date: 2015-11-30
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Publication No.: US09540403B2Publication Date: 2017-01-10
- Inventor: Kunio Mori , Yusuke Matsuno , Katsuhito Mori , Takahiro Kudo
- Applicant: Kunio Mori , Yusuke Matsuno , Katsuhito Mori , Takahiro Kudo
- Applicant Address: JP Morioka-shi JP Morioka-shi
- Assignee: Kunio Mori,Sulfur Chemical Laboratory Incorporated
- Current Assignee: Kunio Mori,Sulfur Chemical Laboratory Incorporated
- Current Assignee Address: JP Morioka-shi JP Morioka-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2010-220512 20100930
- Main IPC: C07F7/08
- IPC: C07F7/08 ; C08K5/3492 ; C08K5/544 ; C07D215/54 ; C07F7/18 ; C07F5/06 ; C09J5/00 ; C07D251/54

Abstract:
To provide a technique by which an —OH group can be effectively formed on a material surface for the purpose of making the material suitable for bonding (for example, for molecular bonding) that utilizes a chemical reaction (chemical binding). [Solution] A bonding method for bonding a substrate A and a substrate B, which comprises: a step for applying an agent that contains the compound (α) described below on the surface of the substrate A; a step for arranging the substrate B so as to face the compound (α) that is present on the surface of the substrate A; and a step for integrally bonding the substrate A and the substrate B by applying a force onto the substrate A and/or the substrate B. The compound (α) is a compound that has an OH group or an OH-forming group, an azide group and a triazine ring in each molecule, and the substrate A is configured using a polymer.
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