Invention Grant
US09540403B2 Bonding method, bondability improving agent, surface modification method, surface modifying agent, and novel compound 有权
粘合方法,粘合性改善剂,表面改性法,表面改性剂,新型化合物

Bonding method, bondability improving agent, surface modification method, surface modifying agent, and novel compound
Abstract:
To provide a technique by which an —OH group can be effectively formed on a material surface for the purpose of making the material suitable for bonding (for example, for molecular bonding) that utilizes a chemical reaction (chemical binding). [Solution] A bonding method for bonding a substrate A and a substrate B, which comprises: a step for applying an agent that contains the compound (α) described below on the surface of the substrate A; a step for arranging the substrate B so as to face the compound (α) that is present on the surface of the substrate A; and a step for integrally bonding the substrate A and the substrate B by applying a force onto the substrate A and/or the substrate B. The compound (α) is a compound that has an OH group or an OH-forming group, an azide group and a triazine ring in each molecule, and the substrate A is configured using a polymer.
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