Coating compositions can be prepared from a polyether resin, wherein the smallest difunctional hydroxyl phenyl segment used to form the polyether resin has a molecular weight greater than about 500, and wherein the smallest difunctional hydroxyl phenyl segment used to form the polyether resin does not comprise two or more non-impaired hydroxyl groups attached to two or more different five-membered or six-membered carbon atom rings in a segment having a molecular weight less than about 500. The polyether resin can be prepared by reacting a dihydroxyl compound and/or a diamine compound with a phenol stearic acid compound to produce a diphenol, and reacting the diphenol with a diglycidyl ether compound to form the polyether resin.