Invention Grant
- Patent Title: Silicon-based repair methods and composition
- Patent Title (中): 硅基修复方法和组成
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Application No.: US14589021Application Date: 2015-01-05
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Publication No.: US09540497B2Publication Date: 2017-01-10
- Inventor: Don Mark Lipkin , Nicholas Edward Antolino , David Poerschke , Kevin Paul McEvoy
- Applicant: GENERAL ELECTRIC COMPANY
- Applicant Address: US NY Niskayuna
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Niskayuna
- Agent John P. Darling
- Main IPC: C08K3/34
- IPC: C08K3/34 ; B29C73/02 ; C09D183/04 ; C08K3/36 ; C08K3/22

Abstract:
There is set forth herein a silicon-based patch formulation comprising about 25 to 66 percent by volume of a solvent; about 4 to 10 percent by volume of a silicon-comprising binding material; and about 30 to 65 percent by volume of a patching material, the patching material comprising particles having one or more non-actinide Group IIIA elements, wherein a molar ratio of the one or more non-actinide Group IIIA elements to silicon within the patch formulation is about 0.95 to 1.25.
Public/Granted literature
- US20160194476A1 SILICON-BASED REPAIR METHODS AND COMPOSITION Public/Granted day:2016-07-07
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