The present disclosure provides a resin suitable for use in rotational molding having an environmental stress crack resistance of greater than 1000 hours. The resin has a density from 0.937 to 0.942 g/cm3, a melt index I2 determined according to ASTM D 1238 (2.16 kg/190° C.—I2) from 4.0 to 7.0 g/10 min, an I21 determined according to ASTM D 1238 (21.6 kg/190° C.—I21) from 160 to 200 g/10 min, an I21/I2 from 30 to 40 and a terminal vinyl unsaturation greater than 0.06, per 1000 carbon atoms; and a primary structure parameter (PSP2) of from 4 to 7, and an overall Mw/Mn from 2.7 to 3.5 comprising from 2 to 5 weight % of one or more C4-8 alpha olefin comonomers.