Invention Grant
- Patent Title: Heat-curable polymer paste
- Patent Title (中): 热固性聚合物糊
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Application No.: US14474545Application Date: 2014-09-02
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Publication No.: US09540536B2Publication Date: 2017-01-10
- Inventor: Takuya Konno , Naoto Nakajima
- Applicant: E I DU PONT DE NEMOURS AND COMPANY
- Applicant Address: US DE Wilmington
- Assignee: E I DU PONT DE NEMOURS AND COMPANY
- Current Assignee: E I DU PONT DE NEMOURS AND COMPANY
- Current Assignee Address: US DE Wilmington
- Main IPC: C08K5/3492
- IPC: C08K5/3492 ; C08K3/22 ; C08K3/30 ; C08K3/36 ; C08L61/28 ; C08L67/00 ; C09D161/28 ; C09D167/00 ; H01L33/46 ; H01L33/48 ; H01L33/52 ; C08K5/00 ; C08K3/00 ; H01L33/56
Abstract:
A heat-curable polymer paste comprising: (i) 100 parts by weight of a transparent polyester resin having a hydroxyl value of 1 to 10 mgKOH/g and a glass transition point (Tg) of 40 to 120° C., (ii) 1 to 30 parts by weight of a crosslinking agent comprising methoxymethyl imino melamine represented as formula (I); (C2N3)[—N(H)(CH2OCH3)]n[—N(CH2OCH3)2]3-n (I) wherein n is 1 to 3, and (iii) 50 to 200 parts by weight of an organic solvent.
Public/Granted literature
- US20160060479A1 HEAT-CURABLE POLYMER PASTE Public/Granted day:2016-03-03
Information query
