Invention Grant
- Patent Title: Heat-curable polyorganosiloxane composition and use thereof
- Patent Title (中): 热固性聚有机硅氧烷组合物及其用途
-
Application No.: US13700573Application Date: 2011-12-06
-
Publication No.: US09540551B2Publication Date: 2017-01-10
- Inventor: Koji Okawa , Kazuhisa Ono
- Applicant: Koji Okawa , Kazuhisa Ono
- Applicant Address: JP Tokyo
- Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
- Current Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz & Volek PC
- Priority: JP2010-286155 20101222
- International Application: PCT/JP2011/078146 WO 20111206
- International Announcement: WO2012/086404 WO 20120628
- Main IPC: C09J183/07
- IPC: C09J183/07 ; C09J183/04 ; C08G77/12 ; C08K5/5419 ; C08G77/20 ; C08K5/56
Abstract:
A heat-curable polyorganosiloxane composition which includes (A) an alkenyl group-containing linear polyorganosiloxane of the formula (I) below, wherein Ra represents a C2-C6 alkenyl and Rb represents a C1-C6 alkyl or a phenyl; (B1) a linear polyorganohydrogensiloxane of the formula (II) below, wherein Rc is hydrogen and Rd represents a C1-C6 alkyl or a phenyl; (B2) a cyclic polyorganohydrogensiloxane including Re2HSiO1/2, wherein Re represents a hydrogen atom or C1-C6 alkyl group, and SiO4/2, and having three or more hydrogen atoms bonded to a silicon atom in one molecule; (C) a platinum series catalyst; and (D) an adhesion promoter, wherein the formula (I) and the formula (II) are as follows:
Public/Granted literature
- US20130071673A1 HEAT-CURABLE POLYORGANOSILOXANE COMPOSITION AND USE THEREOF Public/Granted day:2013-03-21
Information query
IPC分类:
