Invention Grant
- Patent Title: Methods for forming highly conductive propped fractures
- Patent Title (中): 形成高导电性支撑骨折的方法
-
Application No.: US13597597Application Date: 2012-08-29
-
Publication No.: US09540561B2Publication Date: 2017-01-10
- Inventor: Philip D. Nguyen
- Applicant: Philip D. Nguyen
- Applicant Address: US TX Houston
- Assignee: Halliburton Energy Services, Inc.
- Current Assignee: Halliburton Energy Services, Inc.
- Current Assignee Address: US TX Houston
- Agency: McDermott Will & Emery LLP
- Agent Craig Roddy
- Main IPC: E21B43/267
- IPC: E21B43/267 ; C09K8/80 ; C09K8/88 ; C09K8/92

Abstract:
Methods of propping subterranean fractures using swellable particulates. Some methods alternate the placement into a fracture of proppant and swellable particulates. Other methods alternate the placement into a fracture of proppant-free fluid and swellable particulates. Still other methods combine proppant and swellable particulates into a single fluid and place that fluid into a subterranean fracture. The methods are useful for treatment of low closure stress formations.
Public/Granted literature
- US20140060829A1 Methods for Forming Highly Conductive Propped Fractures Public/Granted day:2014-03-06
Information query
IPC分类: