Invention Grant
- Patent Title: Plasma processing equipment and gas distribution apparatus thereof
- Patent Title (中): 等离子体处理设备及其气体分配设备
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Application No.: US14339243Application Date: 2014-07-23
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Publication No.: US09540732B2Publication Date: 2017-01-10
- Inventor: Liqiang Yao
- Applicant: Beijing NMC Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: Beijing NMC Co., Ltd.
- Current Assignee: Beijing NMC Co., Ltd.
- Current Assignee Address: CN Beijing
- Agency: Locke Lord LLP
- Agent Howard M. Gitten
- Priority: CN200810056179 20080114
- Main IPC: C23C16/455
- IPC: C23C16/455 ; H01J37/32 ; C23C16/513 ; H01L21/67

Abstract:
A gas distribution apparatus for a plasma processing equipment is provided. The gas distribution apparatus includes a support plate (3) and a showerhead electrode (5) that are secured together parallelly to define a chamber for gas distribution. A first gas distribution plate (4) is arranged in the chamber horizontally. On an upper surface of the gas distribution plate (4), at least one circumferential gas-flow groove (41) around its axis and a plurality of radial gas-flow grooves (42) communicating with the at least one circumferential gas-flow groove (41) is arranged. A plurality of axial viahole (43) are formed in the at least one circumferential gas-flow groove (41) and the plurality of radial gas-flow grooves (42). The gas distribution apparatus can achieve a uniform gas distribution in the plasma processing equipment.
Public/Granted literature
- US20140332605A1 PLASMA PROCESSING EQUIPMENT AND GAS DISTRIBUTION APPARATUS THEREOF Public/Granted day:2014-11-13
Information query
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