Invention Grant
- Patent Title: Evacuation apparatus
- Patent Title (中): 疏散装置
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Application No.: US10563255Application Date: 2004-10-14
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Publication No.: US09541088B2Publication Date: 2017-01-10
- Inventor: Takeshi Kawamura , Koichi Kagawa
- Applicant: Takeshi Kawamura , Koichi Kagawa
- Applicant Address: JP Tokyo
- Assignee: EBARA CORPORATION
- Current Assignee: EBARA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2003-358424 20031017
- International Application: PCT/JP2004/015563 WO 20041014
- International Announcement: WO2005/038255 WO 20050428
- Main IPC: F04C18/16
- IPC: F04C18/16 ; F04C28/08 ; C23C16/44 ; F04C18/12 ; F04C23/00 ; F04C25/02 ; H01J37/32 ; F01C21/00
Abstract:
The present invention relates to an evacuation apparatus for evacuating a vacuum chamber of a substrate processing apparatus for processing a substrate such as a semiconductor wafer or liquid crystal panel. An evacuation apparatus according to the present invention includes a first vacuum pump connected to a vacuum chamber, and a second vacuum pump connected to the first vacuum pump. The first vacuum pump has a pair of multistage pump rotors.
Public/Granted literature
- US20070104587A1 Evacuation apparatus Public/Granted day:2007-05-10
Information query
