Invention Grant
- Patent Title: Surveying system and method
- Patent Title (中): 测量系统和方法
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Application No.: US14436445Application Date: 2013-10-15
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Publication No.: US09541392B2Publication Date: 2017-01-10
- Inventor: Damien Dusha
- Applicant: LEICA GEOSYSTEMS AG
- Applicant Address: CH Heerbrugg
- Assignee: LEICA GEOSYSTEMS AG
- Current Assignee: LEICA GEOSYSTEMS AG
- Current Assignee Address: CH Heerbrugg
- Agency: Maschoff Brennan
- Priority: EP12188965 20121018
- International Application: PCT/EP2013/071548 WO 20131015
- International Announcement: WO2014/060429 WO 20140424
- Main IPC: G01C15/00
- IPC: G01C15/00 ; G01C15/06 ; G01C21/16

Abstract:
Surveying system for measuring the position of a measuring point on the ground is disclosed. The surveying system may include a survey pole with a body having a pointer tip for contacting the measuring point and position giving means for making available the coordinative determination of a referenced position, being placed on the body with a defined spatial relationship relative to the tip. Determination means may be included for repeatedly determining the referenced position of the position giving means. Evaluation means may also be included for deriving the position of the measuring point. In some embodiments, the survey pole may also include an inertial measuring unit placed on the body with a defined spatial relationship relative to the position giving means.
Public/Granted literature
- US20150268045A1 SURVEYING SYSTEM AND METHOD Public/Granted day:2015-09-24
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