Embodiments of the invention are based on a method for positioning a carrier with a plurality of electronic components in a device for testing the electronic components, wherein the carrier is provided with a pick-and-place unit.According to embodiments of the invention several markings at one side of the carrier are detected with at least one camera and the position of the markings is determined in relation to the known position of a nest for receiving the carrier, the nest is moved into a position exactly opposite to the carrier, the carrier is handed over to the nest, several further markings at the other side of the carrier are detected by at least one further camera and the position of the further markings is determined in relation to the determined position of a test socket, the nest is positioned in a position exactly opposite to the test socket and the carrier is pressed against the test socket.