Invention Grant
- Patent Title: Method and apparatus for baking photoresist patterns
- Patent Title (中): 光刻胶图案的烘烤方法和装置
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Application No.: US14176314Application Date: 2014-02-10
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Publication No.: US09541836B2Publication Date: 2017-01-10
- Inventor: Chin-Min Lin , De-Fang Huang , Ching-Hui Tsao
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsin-Chu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: F27B5/14
- IPC: F27B5/14 ; H01L21/67 ; H01L21/66 ; H01L21/027 ; G03F7/40 ; H01L21/677 ; F27B17/00
Abstract:
In accordance with some embodiments, a method and an apparatus for baking photoresist patterns are provided. The method includes putting a wafer over a heating assembly. A photoresist pattern is formed over a top surface of the wafer. The method further includes curing the wafer from the top surface of the wafer by a curing assembly while heating the wafer from a bottom surface of the wafer by a heating assembly.
Public/Granted literature
- US20150227050A1 METHOD AND APPARATUS FOR BAKING PHOTORESIST PATTERNS Public/Granted day:2015-08-13
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