Invention Grant
- Patent Title: Homogeneous thermal equalization with active device
- Patent Title (中): 有源器件的均匀热均衡
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Application No.: US14019614Application Date: 2013-09-06
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Publication No.: US09541846B2Publication Date: 2017-01-10
- Inventor: Shih-Ming Chang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Associates, LLC
- Main IPC: G03B27/32
- IPC: G03B27/32 ; G03B27/52 ; G03B27/58 ; H02K41/02 ; G03F7/20

Abstract:
A system and method is provided for providing a thermal distribution on a workpiece during a lithographic process. The system provides a source of lithographic energy to workpiece, such as a workpiece having a lithographic film formed thereover. A workpiece support having a plurality of thermal devices embedded therein is configured to support the workpiece concurrent to an exposure of the workpiece to the lithographic energy. A controller individually controls a temperature of each of the plurality of thermal devices, therein controlling a specified temperature distribution across the workpiece associated with the exposure of the workpiece to the lithographic energy. Controlling the temperature of the thermal devices can be based on a model, a measured temperature of the workpiece, and/or a prediction of a temperature at one or more locations on the workpiece.
Public/Granted literature
- US20150070665A1 Homogeneous Thermal Equalization with Active Device Public/Granted day:2015-03-12
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