Invention Grant
- Patent Title: Pattern inspection apparatus and pattern inspection method
- Patent Title (中): 图案检验装置和图案检验方法
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Application No.: US13572972Application Date: 2012-08-13
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Publication No.: US09542586B2Publication Date: 2017-01-10
- Inventor: Eiji Matsumoto , Nobutaka Kikuiri , Hideo Tsuchiya
- Applicant: Eiji Matsumoto , Nobutaka Kikuiri , Hideo Tsuchiya
- Applicant Address: JP Numazu-shi
- Assignee: NuFlare Technology, Inc.
- Current Assignee: NuFlare Technology, Inc.
- Current Assignee Address: JP Numazu-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2011-178877 20110818
- Main IPC: G03F7/20
- IPC: G03F7/20 ; G01N21/956 ; G06K9/00 ; H04N7/18 ; G01B11/02 ; G01N21/95 ; H01L21/66 ; G03F1/84

Abstract:
A pattern inspection method according to one aspect of the present invention includes generating a first positional deviation amount map by using data acquired by a pre-scan, generating a second positional deviation amount map by using data acquired by a full scan, generating a first positional deviation difference map by calculating a difference between the first positional deviation amount map and the second positional deviation amount map, generating a third positional deviation amount map from the first positional deviation difference map and the second positional deviation amount map, and judging existence of a value exceeding an allowable value, in values defined by the third positional deviation amount map.
Public/Granted literature
- US20130044205A1 PATTERN INSPECTION APPARATUS AND PATTERN INSPECTION METHOD Public/Granted day:2013-02-21
Information query
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