A chip coil component may include: a ceramic body including a plurality of first to fourth insulating layers, and an internal coil including a first internal pattern part having the plurality of first insulating layers on which first pattern portions are disposed and a second internal pattern part having the plurality of second insulating layers on which second pattern portions are disposed. The first pattern portions disposed on the plurality of first insulating layers are disposed to correspond to each other and are connected to each other by two first connection terminals each having one via electrode, and the second pattern portions disposed on the plurality of second insulating layers are disposed to correspond to each other and are connected to each other by two second connection terminals each having one via electrode.