Invention Grant
- Patent Title: Electronic component and method of manufacturing the same
- Patent Title (中): 电子部件及其制造方法
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Application No.: US14144384Application Date: 2013-12-30
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Publication No.: US09543076B2Publication Date: 2017-01-10
- Inventor: Moon Il Kim , Byoung Hwa Lee , Doo Hwan Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2012-0158338 20121231
- Main IPC: H01G4/228
- IPC: H01G4/228 ; H01G4/30 ; H01G4/232

Abstract:
Disclosed herein are an electronic component and a method of manufacturing the same. In an electronic component having a conductor formed in an insulator and providing an external electrode electrically connected to the conductor on an outer surface of the insulator, a curvature of the external electrode in a via machining region is decreased at a predetermined level or less, thereby making it possible to decrease defect generation due to a glare-reflection of a laser.
Public/Granted literature
- US20140185188A1 ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2014-07-03
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