Invention Grant
- Patent Title: Electrostatic chuck and method of manufacturing semiconductor device
- Patent Title (中): 静电卡盘及制造半导体装置的方法
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Application No.: US13305139Application Date: 2011-11-28
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Publication No.: US09543182B2Publication Date: 2017-01-10
- Inventor: Akira Furuya , Takamitsu Kitamura
- Applicant: Akira Furuya , Takamitsu Kitamura
- Applicant Address: JP Osaka
- Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee Address: JP Osaka
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2010-265790 20101129
- Main IPC: H01L21/683
- IPC: H01L21/683
Abstract:
An electrostatic chuck device including: a plurality of adsorption areas having an electrode generating electrostatic attractive force; and a control portion controlling the electrostatic attractive force against each of the plurality of the adsorption areas independently of other adsorption areas.
Public/Granted literature
- US20120134065A1 ELECTROSTATIC CHUCK AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2012-05-31
Information query
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