Invention Grant
- Patent Title: Heated electrostatic chuck and semiconductor wafer heater and methods for manufacturing same
- Patent Title (中): 加热静电卡盘和半导体晶片加热器及其制造方法
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Application No.: US14038039Application Date: 2013-09-26
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Publication No.: US09543183B2Publication Date: 2017-01-10
- Inventor: Jae Yong Cho , Kevin Argabright , James E. LaRoche, III , Mahmood Naim , David R. Hammerich , John R. Miller
- Applicant: FM INDUSTRIES, INC.
- Applicant Address: US CA Fremont
- Assignee: FM Industries, Inc.
- Current Assignee: FM Industries, Inc.
- Current Assignee Address: US CA Fremont
- Agency: Burr & Brown, PLLC
- Main IPC: H05B11/00
- IPC: H05B11/00 ; H01L21/683 ; H01L21/67
Abstract:
A heated electrostatic chuck is provided, including a base having an upper surface and peripheral side surfaces, a thermal barrier coating formed by plasma deposition directly on at least the upper surface of the base, at least one heating element formed on portions of the thermal barrier coating, an electrically insulating layer formed on the heating element and exposed portions of the thermal barrier coating, at least one chucking electrode formed on at least a portion of the electrically insulating layer, and a protective layer formed on the chucking electrode.
Public/Granted literature
- US20140291311A1 HEATED ELECTROSTATIC CHUCK AND SEMICONDUCTOR WAFER HEATER AND METHODS FOR MANUFACTURING SAME Public/Granted day:2014-10-02
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