Invention Grant
- Patent Title: Substrate support with controlled sealing gap
- Patent Title (中): 基板支撑，控制密封间隙
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Application No.: US13756719Application Date: 2013-02-01
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Publication No.: US09543186B2Publication Date: 2017-01-10
- Inventor: Olkan Cuvalci , Joel M. Huston , Gwo-Chuan Tzu
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser Taboada
- Agent Alan Taboada
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/687 ; B25B11/00 ; H01L21/67
Abstract:
Embodiments of substrate supports are provided herein. In some embodiments, a substrate support may include a support plate having a support surface to support a substrate, a support ring to support a substrate at a perimeter of the support surface; and a plurality of first support elements disposed in the support ring, wherein an end portion of each of the first support elements is raised above an upper surface of the support ring to define a gap between the upper surface of the support ring and an imaginary plane disposed on the end portions of the plurality of first support elements.
Public/Granted literature
- US20140217665A1 SUBSTRATE SUPPORT WITH CONTROLLED SEALING GAP Public/Granted day:2014-08-07
Information query
IPC分类:
