Invention Grant
US09543218B2 Semiconductor component and method for producing a semiconductor component
有权
半导体元件的制造方法及半导体元件的制造方法
- Patent Title: Semiconductor component and method for producing a semiconductor component
- Patent Title (中): 半导体元件的制造方法及半导体元件的制造方法
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Application No.: US14060068Application Date: 2013-10-22
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Publication No.: US09543218B2Publication Date: 2017-01-10
- Inventor: Christoph Eichler , Uwe Strauss
- Applicant: OSRAM Opto Semiconductors GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
- Current Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
- Current Assignee Address: DE Regensburg
- Agency: Slater Matsil, LLP
- Priority: DE102008016489 20080331; DE102008021674 20080430
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01S5/22
Abstract:
A method can be used to produce a semiconductor component. A semiconductor layer sequence has an active region that is provided for generating radiation and also has an indicator layer. Material of the semiconductor layer sequence that is arranged on that side of the indicator layer that is remote from the active region is removed in regions. The material is removed using a dry-chemical removal of the semiconductor layer sequence. A property of a process gas is monitored during the removal to determine that the indicator layer has been reached based on a change in the property of the process gas.
Public/Granted literature
- US20140045279A1 Semiconductor Component and Method for Producing a Semiconductor Component Public/Granted day:2014-02-13
Information query
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