中科微点-全球专利检索

  1. Login
  2. Sign Up
Invention Grant
US09543227B2 Semiconductor device 有权
半导体器件

Semiconductor device
Abstract:
A semiconductor device (10) includes a metallic base plate (22) provided with an upper surface (22a) and a lower surface (22b), a plurality of insulating substrates (24) provided on the upper surface (22a), and a plurality of semiconductor elements (26) and (28) mounted side by side on the respective insulating substrates (24). Annular grooves (50) and (52) for storing insulating grease are provided on the lower surface (22b) of the base plate (22). A surface (40a) of a cooling fin (40) is superimposed on the lower surface (22b) with insulating grease (42) interposed therebetween and insides of the annular grooves (50) and (52) are filled with the insulating grease (42).
Abstract(Chinese):

一种半导体器件（10）包括设置有上表面（22a）和下表面（22b）的金属基板（22），设置在上表面（22a）上的多个绝缘基板（24） 的半导体元件（26）和（28）并排安装在各绝缘基板（24）上。 在基板（22）的下表面（22b）上设置用于储存绝缘油脂的环形槽（50）和（52）。 冷却翅片（40）的表面（40a）通过绝缘油脂（42）重叠在下表面（22b）上，并且环形槽（50）和（52）的内部填充有绝缘油脂（42） ）。

Public/Granted literature
Information query
Espacenet
Patent Agency Ranking
0/0