Invention Grant
- Patent Title: Semiconductor package and fabricating method thereof
- Patent Title (中): 半导体封装及其制造方法
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Application No.: US14823689Application Date: 2015-08-11
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Publication No.: US09543242B1Publication Date: 2017-01-10
- Inventor: Michael Kelly , David Hiner , Ronald Huemoeller , Roger St. Amand
- Applicant: Amkor Technology, Inc.
- Applicant Address: US AZ Tempe
- Assignee: AMKOR TECHNOLOGY, INC.
- Current Assignee: AMKOR TECHNOLOGY, INC.
- Current Assignee Address: US AZ Tempe
- Agency: McAndrews, Held & Malloy, Ltd.
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/31 ; H01L25/07
Abstract:
A semiconductor device structure and a method for making a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a thin fine-pitch redistribution structure.
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