Invention Grant
- Patent Title: Surface-mount electronic component
- Patent Title (中): 表面贴装电子元件
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Application No.: US15051158Application Date: 2016-02-23
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Publication No.: US09543247B1Publication Date: 2017-01-10
- Inventor: Olivier Ory
- Applicant: STMicroelectronics (Tours) SAS
- Applicant Address: FR Tours
- Assignee: STMicroelectronics (Tours) SAS
- Current Assignee: STMicroelectronics (Tours) SAS
- Current Assignee Address: FR Tours
- Agency: Gardere Wynne Sewell, LLP
- Priority: FR1558067 20150831
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L29/06 ; H01L29/16 ; H01L23/528 ; H01L21/306 ; H01L21/304 ; H01L21/302 ; H01L21/768 ; H01L21/78
Abstract:
A surface-mount chip is formed by a silicon substrate having a front surface and a side. The chip includes a metallization intended to be soldered to an external device. The metallization has a first portion covering at least a portion of the front surface of the substrate and a second portion covering at least a portion of the side of the substrate. A porous silicon region is included in the substrate to separating the second portion of the metallization from the rest of the substrate.
Information query
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