Invention Grant
- Patent Title: Semiconductor chip and semiconductor package having the same
- Patent Title (中): 半导体芯片和半导体封装相同
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Application No.: US14339029Application Date: 2014-07-23
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Publication No.: US09543251B2Publication Date: 2017-01-10
- Inventor: Tae Min Kang , Dae Woong Lee , Jong Hoon Kim
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si
- Assignee: SK HYNIX INC.
- Current Assignee: SK HYNIX INC.
- Current Assignee Address: KR Icheon-si
- Agency: William Park & Associates Ltd.
- Priority: KR10-2014-0032425 20140320
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/58 ; H01L25/065 ; H01L23/31 ; H01L21/78 ; H01L21/304
Abstract:
A semiconductor chip includes a semiconductor substrate having a front surface, a circuit unit formed within the semiconductor substrate and extending from the front surface into the semiconductor substrate, and a rear surface opposite the front surface, and a girder beam disposed outside of the circuit unit and within the semiconductor substrate.
Public/Granted literature
- US20150270229A1 SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE HAVING THE SAME Public/Granted day:2015-09-24
Information query
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