An ultra-fine pitch wedge bonding tool and method for its manufacture are disclosed. The wedge tool is formed with a foot width calculated to enable accurate bonding of wires separated at an ultra-fine pitch. The wedge tool is made out of a tungsten carbide alloy having characteristics conforming to specified constraints that lead to improved performance and enable the use of thicker wire. A pocket is formed at the tip of the wedge tool and a wire feeding hole is formed from the rear side of the tool and exiting inside the pocket, at an elevation above the bonding foot. Side walls are provided on both sides of the pocket to guide the wire exiting the feed hole inside the pocket towards the bonding foot.