Invention Grant
- Patent Title: 3D packages and methods for forming the same
- Patent Title (中): 3D封装及其形成方法
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Application No.: US14970250Application Date: 2015-12-15
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Publication No.: US09543284B2Publication Date: 2017-01-10
- Inventor: Ming-Chih Yew , Fu-Jen Li , Kuo-Chuan Liu , Po-Yao Lin , Wen-Yi Lin
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L21/56 ; H01L21/768 ; H01L23/00 ; H01L23/498 ; H01L25/10 ; H01L25/065 ; H01L25/00 ; H01L23/48 ; H01L23/31
Abstract:
Embodiments of the present disclosure include a semiconductor device, a package and methods of forming a semiconductor device and a package. An embodiment is a semiconductor device including a molding material over a first substrate with a first opening having a first width in the molding material. The semiconductor device further includes a second opening having a second width in the molding material with the second width being greater than the first width. A first connector is in the first opening and a second connector is in the second opening.
Public/Granted literature
- US20160111409A1 3D Packages and Methods for Forming the Same Public/Granted day:2016-04-21
Information query
IPC分类:
