Invention Grant
- Patent Title: Forming IV fins and III-V fins on insulator
- Patent Title (中): 在绝缘体上形成IV鳍和III-V鳍
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Application No.: US14992050Application Date: 2016-01-11
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Publication No.: US09543302B2Publication Date: 2017-01-10
- Inventor: Kangguo Cheng , Bruce B. Doris , Pouya Hashemi , Ali Khakifirooz , Alexander Reznicek
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Andrew G. Wakim
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L29/786 ; H01L29/06 ; H01L29/10 ; H01L29/20 ; H01L29/16 ; H01L21/3115 ; H01L21/311

Abstract:
A semiconductor structure including: a set of first fins in a pFET region and a set of second fins in an nFET region, the first fins and the second fins are on a buried insulator layer, the first fins have a bottom surface coplanar with a bottom surface of the second fins, the first fins have a first pitch between adjacent first fins that is equal to a second pitch between adjacent second fins, the first fins include a group IV semiconductor material, the second fins include a group III-V semiconductor material.
Public/Granted literature
- US20160126244A1 FORMING IV FINS AND III-V FINS ON INSULATOR Public/Granted day:2016-05-05
Information query
IPC分类: