Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US14820555Application Date: 2015-08-07
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Publication No.: US09543427B2Publication Date: 2017-01-10
- Inventor: Chiaki Kudou , Haruyuki Sorada , Tsuneichiro Sano
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2014-180139 20140904
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/08 ; H01L29/10 ; H01L29/423 ; H01L29/66 ; H01L21/3213 ; H01L21/02

Abstract:
A semiconductor device includes: semiconductor layer having an impurity region of a first conductivity type; a gate insulating layer, at least a part of the gate insulating layer positioned on the semiconductor layer; a gate electrode positioned on the gate insulating layer and having a first surface in contact with the part of the gate insulating film and a second surface opposite to the first surface; an interlayer insulating layer covering the gate electrode; and an electrode in contact with the impurity region. The gate electrode has a recess at a corner in contact with the second surface, in a cross section of the gate electrode perpendicular to a surface of the semiconductor layer. A cavity surrounded by the gate electrode and the interlayer insulating layer is positioned in a region including at least a part of the recess.
Public/Granted literature
- US20160071971A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2016-03-10
Information query
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