Invention Grant
- Patent Title: Semiconductor device structure and manufacturing method thereof
- Patent Title (中): 半导体器件结构及其制造方法
-
Application No.: US14609988Application Date: 2015-01-30
-
Publication No.: US09543439B2Publication Date: 2017-01-10
- Inventor: Chin-I Liao , Shih-Chieh Chang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C., Intellectual Property Attorneys
- Agent Anthony King
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/165 ; H01L29/36 ; H01L29/06

Abstract:
Some embodiments of the present disclosure provide a semiconductor device. The semiconductor device includes a semiconductive substrate; a gate structure over a fin structure of the semiconductive substrate; a channel portion of the fin structure under the gate structure; and at least one epitaxy region disposed over the semiconductive substrate and in contact with the channel portion. The epitaxy region includes a substance with a first lattice constant larger than a second lattice constant of the semiconductive substrate; and a concentration profile of the substance in the epitaxy region being decreasing from near a bottom portion to near a top portion. The bottom portion is closer to the channel portion than the top portion.
Public/Granted literature
- US20160225904A1 SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2016-08-04
Information query
IPC分类: