Invention Grant
- Patent Title: Semiconductor structure and method of forming the same
- Patent Title (中): 半导体结构及其形成方法
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Application No.: US14929396Application Date: 2015-11-01
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Publication No.: US09543448B1Publication Date: 2017-01-10
- Inventor: Chia-Fu Hsu , Chun-Yuan Wu
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Priority: TW104127820A 20150826
- Main IPC: H01L29/10
- IPC: H01L29/10 ; H01L29/786 ; H01L29/66 ; H01L29/40 ; H01L29/45

Abstract:
The present invention provides a semiconductor structure, including a base, a patterned oxide semiconductor (OS) layer, two source/drain regions, a protective layer, a gate layer and a gate dielectric layer. The patterned OS layer is disposed on the base. Two source/drain regions are disposed on the patterned OS layer and are separated by a recess. Each source/drain region includes an inner sidewall facing the recess and an outer sidewall opposite to the inner sidewall. The protective layer is disposed on a sidewall of the patterned OS layer but is not on the inner sidewall of the source/drain region. The gate layer is disposed on the patterned OS layer, and the gate dielectric layer is disposed between the gate layer and the patterned OS layer. The present invention further provides a method of forming the same.
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