Invention Grant
- Patent Title: Signal distribution in integrated circuit using optical through silicon via
- Patent Title (中): 集成电路中信号分布采用光通硅
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Application No.: US14524569Application Date: 2014-10-27
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Publication No.: US09543463B2Publication Date: 2017-01-10
- Inventor: Effendi Leobandung , James D. Warnock , Dieter Wendel
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Ryan, Mason & Lewis, LLP
- Agent Louis J. Percello
- Main IPC: H01L27/15
- IPC: H01L27/15 ; H01L31/12 ; H01L31/153 ; H01L31/167 ; H01L31/0232 ; H01L31/105 ; H01L31/107 ; H01L31/11 ; H01L31/18 ; H01S5/022

Abstract:
An optical through silicon via is formed in a silicon substrate of an integrated circuit. A photo detector is formed within the integrated circuit and is optically coupled to a first side of the optical through silicon via. A light generating source optically coupled to a second side of the optical through silicon via is provided. The photo detector is configured to receive a light, generated by the light generating source, propagating through the optical through silicon via. The light, generated by the light generating source, is controlled by a signal generated by a signal generating source.
Public/Granted literature
- US20160118528A1 SIGNAL DISTRIBUTION IN INTEGRATED CIRCUIT USING OPTICAL THROUGH SILICON VIA Public/Granted day:2016-04-28
Information query
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