Invention Grant
US09543463B2 Signal distribution in integrated circuit using optical through silicon via 有权
集成电路中信号分布采用光通硅

Signal distribution in integrated circuit using optical through silicon via
Abstract:
An optical through silicon via is formed in a silicon substrate of an integrated circuit. A photo detector is formed within the integrated circuit and is optically coupled to a first side of the optical through silicon via. A light generating source optically coupled to a second side of the optical through silicon via is provided. The photo detector is configured to receive a light, generated by the light generating source, propagating through the optical through silicon via. The light, generated by the light generating source, is controlled by a signal generated by a signal generating source.
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