Invention Grant
US09543469B2 III nitride semiconductor epitaxial substrate and III nitride semiconductor light emitting device, and methods of producing the same
有权
III族氮化物半导体外延衬底和III族氮化物半导体发光器件及其制造方法
- Patent Title: III nitride semiconductor epitaxial substrate and III nitride semiconductor light emitting device, and methods of producing the same
- Patent Title (中): III族氮化物半导体外延衬底和III族氮化物半导体发光器件及其制造方法
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Application No.: US14904207Application Date: 2014-08-06
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Publication No.: US09543469B2Publication Date: 2017-01-10
- Inventor: Masatoshi Iwata , Yoshikazu Ooshika
- Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
- Current Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2013-166377 20130809
- International Application: PCT/JP2014/071351 WO 20140806
- International Announcement: WO2015/020233 WO 20150212
- Main IPC: H01L33/06
- IPC: H01L33/06 ; H01L33/12 ; H01L33/32 ; H01L33/00 ; H01L21/02 ; C30B29/40 ; C30B29/68 ; H01S5/343 ; H01L33/04

Abstract:
A III nitride semiconductor epitaxial substrate having more excellent surface flatness is provided, in which the problems of crack formation and the double peaks in the shape of the EL spectrum are mitigated by employing appropriate conditions for Si doping on an AlN layer on a substrate; a III nitride semiconductor light emitting device; and methods of producing the same. A III nitride semiconductor epitaxial substrate has a substrate of which at least a surface portion is made of AlN, an undoped AlN layer formed on the substrate, an Si-doped AlN buffer layer formed on the undoped AlN layer, and a superlattice laminate formed on the Si-doped AlN buffer layer. The Si-doped AlN buffer layer has an Si concentration of 2.0×1019/cm3 or more and a thickness of 4 nm to 10 nm.
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