Invention Grant
- Patent Title: Thermoelectric conversion module and method of manufacturing the same
- Patent Title (中): 热电转换模块及其制造方法
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Application No.: US13859059Application Date: 2013-04-09
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Publication No.: US09543494B2Publication Date: 2017-01-10
- Inventor: Masaharu Hida , Kazunori Yamanaka
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Kratz, Quintos & Hanson, LLP
- Main IPC: H01L35/32
- IPC: H01L35/32 ; H01L35/08 ; H01L35/22 ; H01L35/34
Abstract:
A p-type semiconductor block is made of a p-type thermoelectric conversion material, and has a pillar portion and a connection portion laterally protruding from the pillar portion. In addition, an n-type semiconductor block is made of an n-type thermoelectric conversion material, and has a pillar portion and a connection portion laterally protruding from the pillar portion. The p-type semiconductor block and the n-type semiconductor block are alternately arranged in such a way that the connection portion of the p-type semiconductor block is connected with the pillar portion of the n-type semiconductor block and the connection portion of the n-type semiconductor block is connected with the pillar portion of the p-type semiconductor block. The connection portions and tip-end portions of the pillar portions are made of a thermoelectric conversion material containing metal powder.
Public/Granted literature
- US20140130838A1 THERMOELECTRIC CONVERSION MODULE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2014-05-15
Information query
IPC分类:
