According to one embodiment, a wireless apparatus includes a mounting board, a semiconductor package and a first layer. The mounting board has a first surface and a second surface opposite to the first surface. The semiconductor package comprises at least one antenna and is mounted on the first surface. The first layer is a conductor formed on the second surface or between the first surface and the second surface, at least one portion of an edge of the first layer being concaved if the antenna is arranged closer to the edge than the center of the first layer when seen in thickness direction of the mounting board.