A connecting pin for an electronic circuit board electrically connects a lead of a component to be surface-mounted to the electronic circuit board to a coating layer on an inner wall of a through-hole of the electronic circuit board. The connecting pin includes a cylindrical body formed of an electrically conductive metal, which is inserted into the through-hole of the electronic circuit board. The lead of the component is press-fitted, and inner surface of the cylindrical body is provided with a plurality of small protrusions deformable when contacting protrusions of the press-fitted lead.