Invention Grant
- Patent Title: Electrical contact assembly
- Patent Title (中): 电接触组件
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Application No.: US13841449Application Date: 2013-03-15
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Publication No.: US09543679B2Publication Date: 2017-01-10
- Inventor: Helge Schmidt , Michael Leidner , Marjorie Myers
- Applicant: Tyco Electronics Corporation , Tyco Electronics AMP GMBH
- Applicant Address: US PA Berwyn DE Bensheim
- Assignee: TYCO ELECTRONICS CORPORATION,TE CONNECTIVITY GERMANY GMBH
- Current Assignee: TYCO ELECTRONICS CORPORATION,TE CONNECTIVITY GERMANY GMBH
- Current Assignee Address: US PA Berwyn DE Bensheim
- Main IPC: H01H1/06
- IPC: H01H1/06 ; H01R13/22 ; H01H3/12 ; H01R13/24 ; H01H1/10 ; H01H13/48

Abstract:
An electrical contact assembly includes a first electrical contact having a first mating element, and a second electrical contact having a second mating element. The first and second electrical contacts being configured to mate together at the first and second mating elements such that the first and second mating elements engage each other at a contact interface. A distribution of contact pressure across the contact interface at least partially coincides with a distribution of electrical current flow across the contact interface.
Public/Granted literature
- US20140099803A1 ELECTRICAL CONTACT ASSEMBLY Public/Granted day:2014-04-10
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