An electrical connector includes a housing and a plurality of terminal wafers. The housing is formed with a plurality of terminal slots along a traverse direction. The terminal wafers are contiguous to each other and retained in the housing. Each terminal wafer has a first terminal, a second terminal and a packaging body. The first terminal has a first contacting section, a first soldering portion and a first embedded section. The second terminal has a second contacting section, a second soldering portion and a second embedded section. The first and second contacting sections are extended along a plugging direction into one corresponding terminal slot. The packaging body wraps the first and second embedded sections. A curve contour of the first embedded section is corresponded to a curve contour of the second embedded section, so that an attachment relationship is configured with substantial identical distance therebetween.