Invention Grant
- Patent Title: Wiring module
- Patent Title (中): 接线模块
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Application No.: US14773999Application Date: 2014-03-10
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Publication No.: US09543711B2Publication Date: 2017-01-10
- Inventor: Osamu Nakayama , Mitsutoshi Morita , Kotaro Takada , Naoki Fukushima
- Applicant: AUTONETWORKS TECHNOLOGIES, LTD. , SUMITOMO WIRING SYSTEMS, LTD. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Mie JP Mie JP Osaka
- Assignee: AUTONETWORKS TECHNOLOGIES, LTD.,SUMITOMO WIRING SYSTEMS, LTD.,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee: AUTONETWORKS TECHNOLOGIES, LTD.,SUMITOMO WIRING SYSTEMS, LTD.,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee Address: JP Mie JP Mie JP Osaka
- Agency: Oliff PLC
- Priority: JP2013-065650 20130327
- International Application: PCT/JP2014/056128 WO 20140310
- International Announcement: WO2014/156580 WO 20141002
- Main IPC: H01R24/00
- IPC: H01R24/00 ; H01R13/66 ; H01M2/10 ; H01M2/20 ; H01M10/48 ; G01K13/00 ; G01K1/14

Abstract:
A wiring module includes an insulating protector that holds a connection member for connecting adjacent electrode terminals, and a temperature detecting member for detecting the temperature of the connection member. The temperature detecting member includes a temperature detecting element, an electric wire connected to the temperature detecting element, an element accommodating section in which the temperature detecting element is accommodated and through which the electric wire is led, and a detection section that is contiguous to the element accommodating section and is arranged to be in contact with the connection member. The element accommodating section is arranged in parallel or perpendicular to the line connecting the shaft centers of two electrode terminals that are connected to each other by the connection member.
Public/Granted literature
- US20160028194A1 WIRING MODULE Public/Granted day:2016-01-28
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