Invention Grant
- Patent Title: Radio frequency interconnect
- Patent Title (中): 射频互连
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Application No.: US14954003Application Date: 2015-11-30
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Publication No.: US09543993B1Publication Date: 2017-01-10
- Inventor: Lan-Chou Cho , Chewn-Pu Jou , Feng Wei Kuo , Huan-Neng Chen , William Wu Shen
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW
- Agency: Hauptman Ham, LLP
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H04B1/04 ; H04B1/10 ; H04L7/00

Abstract:
A radio frequency interconnect includes a plurality of transmitters. Each transmitter is associated with an individual carrier of a plurality of carriers. The radio frequency interconnect also includes a transmission channel communicatively coupled with the transmitters and a plurality of receivers communicatively coupled with the transmission channel. Each receiver is associated with a respective carrier. A combiner on a transmitter-side of the transmission channel is coupled with the transmitters between the transmitters and the transmission channel. A decoupler on a receiver-side of the transmission channel is coupled with the receivers between the receivers and the transmission channel. The radio frequency interconnect also includes at least one channel loss compensation circuit communicatively coupled between the plurality of transmitters and the plurality of receivers.
Information query
IPC分类: