Invention Grant
- Patent Title: Multilevel driver for high speed chip-to-chip communications
- Patent Title (中): 用于高速芯片到芯片通信的多级驱动器
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Application No.: US14829388Application Date: 2015-08-18
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Publication No.: US09544015B2Publication Date: 2017-01-10
- Inventor: Roger Ulrich
- Applicant: Kandou Labs SA
- Applicant Address: CH
- Assignee: KANDOU LABS, S.A.
- Current Assignee: KANDOU LABS, S.A.
- Current Assignee Address: CH
- Agency: Invention Mine LLC
- Main IPC: H04B3/04
- IPC: H04B3/04 ; H03K19/0185 ; H03K19/00 ; H04L25/49
Abstract:
Transmission line driver systems are described which are comprised of multiple paralleled driver elements. The paralleled structure allows efficient generation of multiple output signal levels with adjustable output amplitude, optionally including Finite Impulse Response signal shaping and skew pre-compensation.
Public/Granted literature
- US20150381232A1 Multilevel Driver for High Speed Chip-to-Chip Communications Public/Granted day:2015-12-31
Information query
