Invention Grant
- Patent Title: Boiling refrigerant type cooling system
- Patent Title (中): 沸腾制冷剂型冷却系统
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Application No.: US14551499Application Date: 2014-11-24
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Publication No.: US09544988B2Publication Date: 2017-01-10
- Inventor: Kazuaki Suzuki , Shigemasa Sato , Akio Idei
- Applicant: HITACHI, LTD.
- Applicant Address: JP Tokyo
- Assignee: HITACHI, LTD.
- Current Assignee: HITACHI, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Volpe and Koenig, P.C.
- Priority: JP2011-131027 20110613
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K1/02 ; H01L23/427 ; F25B39/04

Abstract:
A boiling refrigerant type cooling system to suppress overshoot upon start of heat generation and realize stable start of boiling. In the boiling refrigerant type cooling system, a metal boiling heat transfer unit has a base in thermal contact with a heat generating body. The boiling heat transfer unit is in contact with a liquid refrigerant. The boiling heat transfer unit has plural parallel tunnels communicating with the outside via holes or gaps under its surface, a groove deeper than a tunnel diameter formed through all the tunnels in an orthogonal direction to the tunnels, and a cover plate on the groove.
Public/Granted literature
- US20150075200A1 BOILING REFRIGERANT TYPE COOLING SYSTEM Public/Granted day:2015-03-19
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