Invention Grant
- Patent Title: Power chain on a circuit board
- Patent Title (中): 功率链在电路板上
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Application No.: US14354997Application Date: 2013-08-10
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Publication No.: US09545007B2Publication Date: 2017-01-10
- Inventor: Jan Berglund
- Applicant: INCO INNOVATION
- Applicant Address: SE Järfallä
- Assignee: One Inventor Sweden AB
- Current Assignee: One Inventor Sweden AB
- Current Assignee Address: SE Järfallä
- Agency: Reichel Stohry LLP
- Agent Mark C. Reichel; Natalie J. Dean
- Priority: SE1230086 20120829
- International Application: PCT/SE2013/050961 WO 20130810
- International Announcement: WO2014/035314 WO 20140306
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/18 ; H05K1/02
Abstract:
A power chain consisting of a chain comprising links that are electrically conductive elements mounted on a circuit board in at least two layers and in such a way that the elements included in the power chain are assembled shifted and overlapping and in electrical contact with each other.
Public/Granted literature
- US20140338964A1 POWER CHAIN ON A CIRCUIT BOARD Public/Granted day:2014-11-20
Information query
