Invention Grant
- Patent Title: Structures for z-axis interconnection of multilayer electronic substrates
- Patent Title (中): 多层电子基板的z轴互连结构
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Application No.: US14183488Application Date: 2014-02-18
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Publication No.: US09545017B2Publication Date: 2017-01-10
- Inventor: Christopher A Hunrath , Khang Duy Tran , Catherine A Shearer , Kenneth C Holcomb , G Delbert Friesen
- Applicant: ORMET CIRCUITS, INC. , INTEGRAL TECHNOLOGY, INC.
- Applicant Address: US CA San Diego US CA Lake Forest
- Assignee: Ormet Circuits, Inc.,Integral Technology, Inc.
- Current Assignee: Ormet Circuits, Inc.,Integral Technology, Inc.
- Current Assignee Address: US CA San Diego US CA Lake Forest
- Agent Mitchell Brustein
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H05K3/40 ; H05K3/46
Abstract:
Invention z-axis interconnection structures provide a means to mechanically and electrically interconnect layers of metallization in electronic substrates reliably and in any configuration. Invention z-axis interconnection structures comprise a novel bonding film and conductive paste and one- and two-piece building block structures formed therefrom.
Public/Granted literature
- US20140231126A1 STRUCTURES FOR Z-AXIS INTERCONNECTION OF MULTILAYER ELECTRONIC SUBSTRATES Public/Granted day:2014-08-21
Information query
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