Invention Grant
- Patent Title: Housing and housing component
- Patent Title (中): 住房和住房部分
-
Application No.: US14468592Application Date: 2014-08-26
-
Publication No.: US09545019B2Publication Date: 2017-01-10
- Inventor: Masayuki Ishikura
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Chip Law Group
- Priority: JP2013-183238 20130904
- Main IPC: A47B81/00
- IPC: A47B81/00 ; A47B97/00 ; H05K5/00
Abstract:
There is provided a housing including a first housing part including a first side wall, and a second housing part including a second side wall. The first side wall includes a first protruding part on an inner circumferential surface. The second side wall includes, on an outer circumferential surface, a first concave part into which the first protruding part is fitted.
Public/Granted literature
- US20150061476A1 HOUSING AND HOUSING COMPONENT Public/Granted day:2015-03-05
Information query
